Fertigung

Leistungen

Maschinenpark

  • Pick&Place-Linie für SMD und Pin-in-Paste (PiP/THR) mit
    • Mycronic Bestückungsautomat
    • Mycronic Jet-Drucker und Dispenser
    • Reflow-Ofen
  • Selektivlötanlage
  • Vergussmaschine
  • Programmier- und Testtools (Oszilloskop, Logikanalysator, Spektrumanalysator…)
  • UV-Direktdrucker (Vollfarbe)
  • Laserschneid- und Gravursystem
  • CNC-Fräsmaschine
  • Verpackungsmaschinen

Elektronikfertigung

PCB Checkliste

  • Standard 2 layer PCB specifications:
    • 1.6mm board thickness
    • Surface: immersion gold or HASL lead-free
    • 0.4mm copper distance to outline
    • 0.3mm hole size
    • 0.15mm (6mil) traces/spacing
  • Panel size >= 100x100mm
  • Panel outline edge >= 8.0mm
  • Fiducials/reference points (>= 2) on every board
  • No vias in component pads and if not possible then use <= 0.3mm vias
  • Board name/marking with revision
  • Solder mask on vias
  • Solder mask on both sides for 1 layer PCBs (otherwise possible bending)

PCB Komponenten

  • Eagle Part Libraries and Design Rules
  • Reel packaging for SMT components
  • Passive components
    • Resistor, value naming like 100, 1k, 4k7, 68k, 1M
      • 0402 -> 63 mW, 50V
      • 0603 -> 100 mW, 75V
      • 0805 -> 125 mW, 150V
      • 1206 -> 250 mW, 200V
    • Capacitor, value naming like 100n/10V, 1u/25V, 100p/50V/NP0
      • 0402 -> …2.2uF @ 6.3V
      • 0603 -> …4.7uF @ 6.3V
      • 0805 -> …10uF @ 16V
      • 1206 -> …22uF @ 25V
    • Polyfuse, value naming like 0.5A/10V, 1A/16V
    • Standard voltage ratings: 6.3V, 10V, 16V, 20V, 25V, 35V, 50V, 63V, 100V